HiCoFlex® Process

The HiCoFlex® multilayer technology uses rigid substrates, ceramics or glass plates, as a carrier during the multilayer build-up process and the assembly of components. First, a thin 'release layer' is applied on these substrates. The multilayer is built up by repetitive application of polyimide layers and metal layers.

Actually, circuits with up to 5 metal layers have been realized. The total thickness of such a film is about 50 µm. The results are highly flexible, film-like circuits with excellent mechanical and electrical properties.