HiCoFlex®

The HiCoFlex® technology provides you with packaging solutions you never dared to dream of. Imagine a circuit with a thickness of 20 µm that even can be folded. New and forward-pointing solutions are now possible. Have a close look at the MCSP on the picture, the flex requires almost no volume!

No doubt, HiCoFlex® revolutionizes the world of packaging.

HiCoFlex® - The Technology

The HiCoFlex® products consist of multilayer circuits and interconnection cables. The characteristics are a remarkable flexibility and connection density. A HiCoFlex® circuit can be handled like a rigid one during all fabrication processes. The flexible circuit is attached to a rigid substrate during the fabrication and will be detached at the end of all production steps. This means that you benefit from the same fabrication quality and you can use the same production line as for rigid circuits.

The secret of the HiCoFlex® products is hidden in a customized polyimide and in a separation layer. This polyimide withstands temperatures up to 530 °C and the films can even be folded. The separation layer plays one of the key roles in the manufacturing of HiCoFlex® products. This layer is deposited on the substrate on which the circuit will be fabricated. At the end of the fabrication (including testing) the separation layer will guarantee the detachment of the flexible circuit from the supporting substrate.