CompanyTechnologyProductsServicesPublicationsContact
Thin Film ProcessHiCoFlex® ProcessHiCoFlex® 24"NiCr Resistor Foil Ele.Integration into FCBLong Micro CablesChip Embedding



Innovation: HiCoFlex® goes to Volume with new 24“ technology



New: 24“ glass substrates
With a capital investment in our technical equipment we’re able to produce HiCoFlex® on 24-inch glass substrates as from May 2009. For you this opens up a new world: The large-scale production of customized, flexible high-end technology becomes reality – making us an even more efficient partner to work with.

The new production equipment has been installed while intensive testing and technical optimization stages have begun. As from autumn 2009 you can benefit from the following advantages:
• greater capacity
• improved standard production
• attractive conditions



Parallel with the 24“ technology, Hightec is developing latest generation quality control equipment.

Today HiCoFlex® is already the «Real Flexible Solution». 
With our technological innovation we are the first company on the market to offer you the production of Thin Film Microelectronics on 24-inch glass substrates.

At trade fairs this innovation has been met by customers with vast interest – we would be happy to keep you informed.

NEWS

05.05.10

Visit us on our booth 9-123, Hall 9 at SMT Hybrid Packaging 2010; June 8-10 Nuremberg,...


» more
NEWSLETTER
Your name


Your email



HTML emails?



» Delete/edit your email

HIGHTEC MC AG
Fabrikstrasse 9
CH-5600 Lenzburg
Switzerland

Phone +41 (0) 62 885 85 85
Fax +41 (0) 62 885 85 00
info@hightec.ch