Our laser submounts and subassemblies for opto-electronics devices are mainly based on AlN substrates with a layer stack consisting of Ti/Pd/Au.

To optimize your die attach process, we provide you with thin film AuSn solder pads. The efficiency of our production process allows us an extremely competitive pricing.

Resistor Networks | Substrates | O/E-Components | MCM-D | HiCoFlex® | Hybrids | Sensors