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Our multilayer substrates are manufactured by thin film additive techniques and therefore possess a very high interconnection density. Up to 4 layers can be produced on different types of ceramic substrates. The conductor lines consist of Cu / Ni (/Au). Polyimide layers isolate the different metallization layers. Another feature of our MCM is the possibility to integrate high precision NiCr resistors. Of course, Hightec MC can also make all the necessary assembly and test steps in order to deliver the complete circuit you need.

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05.05.10

Visit us on our booth 9-123, Hall 9 at SMT Hybrid Packaging 2010; June 8-10 Nuremberg,...


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HIGHTEC MC AG
Fabrikstrasse 9
CH-5600 Lenzburg
Switzerland

Phone +41 (0) 62 885 85 85
Fax +41 (0) 62 885 85 00
info@hightec.ch