HIGHTEC MC AG
CH-5600 Lenzburg
Switzerland
Aktuelles
MEDTEC Europe in Stuttgart Feb. 26th - 28th 2013
You are welcome to visit us in Stuttgart 2013 on our booth.
SSI Best Poster Award 2009
 | HMC_Smart_Systems_Integration_2009_poster0v3.pdf Our Assistant R & D Manager Dr. Tomasz Debski was awarded with the Best Poster Award at the SMART SYSTEM INTEGRATION 2009 in Brussels. |
HiCoFlex®
| An_ultra-thin_highly_flexible_Multilayer_2007.pdf Flex Technology for Foldable Medical Flip Chip Devices; IMAPS Conf. on Device Packaging, Scottdale AZ, March 17-20, 2008 |
| ULTRA-THIN_HIGHLY_FLEXIBLE_2005.pdf Thin Film Multilayers for Integration into Flex Boards; Intern. Workshop on Flexible & Stretchable Electronics, Leuven, Belgium, Sept. 6-7, 2007 |
| An_ultra-thin_highly_flexible_Multilayer_2007.pdf HiCoFlex® - an ultra-thin, highly flexible Multilayer; Smart System Integration 2007, Paris, March 27-28, 2007 |
| Thin film resistor integration into flex-boards; 5th Intern. Workshop 'Flexible Electronic Systems',Munich, November 29, 2006 |
| ULTRA-THIN_HIGHLY_FLEXIBLE_2005.pdf Ultra-thin, highly flexible RF cables; Memswave 2005, Lausanne, June 23-24, 2005 |
| HiCoFlex-an_ultra-thin_2004.pdf HiCoFlex® - an ultra-thin, highly flexible Multilayer; 3rd International Workshop 'Technology & Production - Processes for Flexible Electronic Systems', Munich, December 2, 2004 |
HiCoFlex® & RF
| HMC_MicroTech_2006_Burkard.pdf Ultra-thin, highly flexible cables and interconnections for low and high frequency; Micro Tech 2006, Cambridge UK, March 7-8, 2006 |
| Ultra-thin_highly_flexible_RF_cables_2005.pdf Ultra-thin, highly flexible RF cables and interconnections; Micro System Technologies 2005, Munich, Oct. 5-6, 2005 |
AuSn for Soldering
| AuSn Thin Film Solder Layers for Assembly of Optoelectronic Devices; 14th EMPC, Friedrichshafen, Germany, June 23-25, 2003 |